With technological advancements, multi-layer aluminum substrates emerged, leveraging the excellent thermal conductivity of aluminum while enabling more complex circuit integration through additional signal layers.
The chemical nickel palladium gold (ENEPIG) process adds a palladium layer to the ENIG process, forming a multi-layer structure of "copper-nickel-palladium-gold".
Through sophisticated conductive circuit design, PCBs have evolved from traditional "connector boards" to intelligent "information highways."
Whether in smartwatches, smart glasses, TWS earbuds, medical-grade patches, or smart clothing, flexible circuit boards (Flexible Printed Circuit, FPC) stand out in this context due to their unique physical properties and high integration capabilities.
Zhuhai Dunliang Company was established in Sanzao, Zhuhai in 2012, specializing in the production of UV single-sided, double-sided, and multi-layer circuit boards with a monthly production capacity of 40,000 square meters.