With its superior precision placement capabilities, SMT processing not only significantly improves the density and reliability of circuit board assembly but also propels the entire industry into a new stage of high-precision manufacturing.
Drilling holes in multi-layer professional customized flexible circuit boards requires solving the problem of interlayer alignment.
In high-frequency circuit applications, aluminum substrates, with their unique material properties and structural design, have become a key solution for suppressing electromagnetic interference.
By eliminating pin penetrations, reducing component size, supporting double-sided wiring, and enabling automated precision placement, SMT fundamentally reshapes the physical architecture of electronic products, significantly increasing the amount of circu
With technological advancements, multi-layer aluminum substrates emerged, leveraging the excellent thermal conductivity of aluminum while enabling more complex circuit integration through additional signal layers.
The chemical nickel palladium gold (ENEPIG) process adds a palladium layer to the ENIG process, forming a multi-layer structure of "copper-nickel-palladium-gold".